Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrate

摘要

The present technology includes: bonding a device formation side of a first substrate having a first device and a device formation side of a second substrate having a second device in opposition to each other; forming a protective film on at least an edge of the second substrate having the second device; and reducing a thickness of the first substrate.

主权项

1. A method of manufacturing an image sensor device, the method comprising:
providing a first substrate having thereon a first device layer and a second substrate having thereon a second device layer, the first device layer containing pixel circuitry for converting light into image signals, the second device layer containing circuitry for processing the image signals, the first substrate being wider than the first device layer in cross section so as to have an edge portion extending beyond an edge of the first device layer; bonding the first and second device layers to each other; forming a protective film on at least an edge of the second substrate; and forming a first thinned portion of the first substrate by reducing a thickness of the first substrate at the edge portion.