发明名称 ダイヤモンドワイヤーソー
摘要 PROBLEM TO BE SOLVED: To provide a diamond wire saw which can prevent the damage of a cutting diamond layer by making a curve surface of a cutting object with a smooth resistance come in contact, prevent microvibration and noise due to a contact of the cutting object with a vertical plane, and elongate service life under the sequential progress of abrasion.SOLUTION: A diamond wire saw (1) of this invention keeps shanks (3) and coils (6) alternately inserted into a core wire rope (2) to constitute a bead (5) by forming a cutting diamond layer (4) on the surface of any shank (3). The whole is coated with a resin layer (7) to make a shank (3) comprise a cylindrical part (3a) and a curved surface part (3b) swelling forward. The cutting diamond layer (4) is formed on the outer surface of the curved surface part (3b), and the resin layer (7) is formed so that the diameter may get smaller to the rearward of the bead (5).
申请公布号 JP5861226(B2) 申请公布日期 2016.02.16
申请号 JP20140009526 申请日期 2014.01.22
申请人 キム ヒョヨン;株式会社ダイアテック 发明人 キム ヒョヨン
分类号 B23D61/18;B28D1/08 主分类号 B23D61/18
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