SPUTTERING TARGET-BACKING PLATE ASSEMBLY

摘要

A sputtering target-backing plate assembly uses a lead material to join a sputtering target and a backing plate. The sputtering target-backing plate assembly covers an outer circumference of the lead material between the sputtering target and the backing plate with a wire-shaped material having a melting point of 600-3500°C whose cross section in an axial direction is circular, elliptical, or rectangular. In case of using the lead material to join the sputtering target and the backing plate, arc or particle creation caused by exposing the lead material between the sputtering target and the backing plate is effectively suppressed.