Heat dissipation apparatus and electronic device using the same

摘要

An electronic device includes a chassis and a heat dissipation apparatus. The chassis includes a sidewall defining a latching hole and a rear wall defining an opening adjacent to the latching hole. The heat dissipation apparatus is detachably inserted in the chassis from the opening. The heat dissipation apparatus includes a casing defining a positioning slot aligning with the latching hole of the chassis, a liquid cooling assembly received in the casing, and a resilient latching member. A first end of the latching member is mounted in the casing. A latching block protrudes out from a second end of the latching member. The latching block extends through the positioning slot, to be latched in the latching hole of the chassis.

主权项

1. A heat dissipation apparatus for being detachably inserted into a chassis, the heat dissipation apparatus comprising:
a casing defining a positioning slot; a liquid cooling assembly received in the casing and comprising a water tank and a heat sink secured to a side of the water tank; and a resilient latching member comprising a first end mounted to an inner surface of the casing, and a second end opposite to the first end, a latching block protruding outwards from the second end of the latching member; wherein the latching block extends through the positioning slot, to be latched to the chassis; the water tank comprises a side wall and two spaced connecting portions protruding out from two opposite ends of the side wall, and each connecting portion defines a latching slot; the heat sink comprises a hollow box and two box latching blocks extending out from two opposite ends of the box; and the box latching blocks are latched into the latching slots.