Electrical component resin, semiconductor device, and substrate

摘要

A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.

主权项

1. An electrical component resin comprising: a plurality of particles of a phase-change-material that phase-changes by heat absorption; the plurality of phase-change-material particles being individually encapsulated with a first electrical insulating material that encloses the phase-change-material to form capsules, with a diameter between 2 micrometers and 100 micrometers; a layer provided between each capsule and the encapsulated phase-change-material and partially enclosing the phase-change-material; and a resin formed of a second electrical insulating material and enclosing the capsules; wherein the layer is composed of inert gas different from the phase-change-material; a substrate comprising an electric circuit composed of layers of the electrical component resin, the electrical component resin containing one of an electrical component and a conductor pattern, the layers being stacked sequentially or with an intermediate layer interposed between the layers.