| 发明名称 | Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level | ||
| 摘要 | A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone is provided. The method includes: providing the MEMS microphone; and forming a protection film, on the acoustic port of the MEMS microphone. The protection film has a porous region over the acoustic port to receive an acoustic signal but resist at least an intruding material. The protection film can at least endure a processing temperature of solder flow. | ||
| 申请公布号 | US9264832(B2) | 申请公布日期 | 2016.02.16 |
| 申请号 | US201314066712 | 申请日期 | 2013.10.30 |
| 申请人 | Solid State System Co., Ltd. | 发明人 | Tsai Cheng-Wei;Lee Chien-Hsing;Liou Jhyy-Cheng |
| 分类号 | H01L21/00;H04R31/00;H04R19/00 | 主分类号 | H01L21/00 |
| 代理机构 | Jianq Chyun IP Office | 代理人 | Jianq Chyun IP Office |
| 主权项 | 1. A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone, comprising: providing the MEMS microphone, wherein the MEMS microphone has a MEMS chip with a backplate and the backplate has a venting-hole layer with a plurality of venting holes; and forming a protection film, on the acoustic port of the MEMS microphone, wherein the protection film has a porous region with a plurality of acoustic holes over the acoustic port to receive an acoustic signal but the acoustic holes are smaller than the venting holes to resist at least an intruding material to pass the venting holes, wherein the protection film can at least endure a processing temperature of solder flow. | ||
| 地址 | Hsinchu TW | ||