Heat pipe assemblies

摘要

Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.

主权项

1. A system, comprising:
a heat pipe including a first surface, a second surface adjacent to the first surface, a third surface adjacent to the second surface and opposite from the first surface, and a fourth surface adjacent to the third surface and opposite from the second surface, wherein the first and third surfaces are flat and parallel with respect to each other; a first semiconductor device assembly coupled to a portion of the first surface; and a second semiconductor device assembly coupled to a portion of the third surface such that the heat pipe is sandwiched between the first and second semiconductor devices.