发明名称 |
Substrate treatment method and substrate treatment apparatus |
摘要 |
A substrate treatment method is provided, which includes: a liquid film forming step of forming a liquid film of a treatment liquid on a front surface of a substrate; a hydrophobization liquid supplying step of supplying a hydrophobization liquid to a center portion of the front surface of the substrate for hydrophobizing the front surface of the substrate, while rotating the substrate; an inactivation suppressing step of suppressing inactivation of the supplied hydrophobization liquid on a peripheral edge portion of the front surface of the substrate simultaneously with the hydrophobization liquid supplying step; and a drying step of drying the substrate to which the hydrophobization liquid has been supplied. |
申请公布号 |
US9259758(B2) |
申请公布日期 |
2016.02.16 |
申请号 |
US201314011285 |
申请日期 |
2013.08.27 |
申请人 |
SCREEN HOLDINGS CO., LTD. |
发明人 |
Emoto Tetsuya;Okutani Manabu |
分类号 |
B05D3/12;B05D1/00;B05C9/12;B05D5/08;H01L21/67;B05D3/02;B05D3/04 |
主分类号 |
B05D3/12 |
代理机构 |
McDermott Will & Emery LLP |
代理人 |
McDermott Will & Emery LLP |
主权项 |
1. A substrate treatment method for treating a front surface of a substrate formed with a predetermined pattern, the method comprising:
a liquid film forming step of forming a liquid film of a treatment liquid on the front surface of the substrate; a hydrophobization liquid supplying step of supplying a hydrophobization liquid to a center portion of the front surface of the substrate for hydrophobizing the front surface of the substrate, while rotating the substrate; an inactivation suppressing step of suppressing inactivation of the supplied hydrophobization liquid on a peripheral edge portion of the front surface of the substrate simultaneously with the hydrophobization liquid supplying step; and a drying step of drying the substrate to which the hydrophobization liquid has been supplied, wherein the inactivation suppressing step includes a heating step of heating at least one of the substrate and the hydrophobization liquid supplied to the front surface of the substrate, wherein at least one of a center portion of the substrate and the hydrophobization liquid supplied to the center portion of the front surface of the substrate is heated with a smaller heat amount per unit area than a peripheral edge portion of the substrate and a hydrophobization liquid supplied to the peripheral edge portion of the front surface of the substrate in the heating step. |
地址 |
Kyoto JP |