发明名称 Substrate treatment method and substrate treatment apparatus
摘要 A substrate treatment method is provided, which includes: a liquid film forming step of forming a liquid film of a treatment liquid on a front surface of a substrate; a hydrophobization liquid supplying step of supplying a hydrophobization liquid to a center portion of the front surface of the substrate for hydrophobizing the front surface of the substrate, while rotating the substrate; an inactivation suppressing step of suppressing inactivation of the supplied hydrophobization liquid on a peripheral edge portion of the front surface of the substrate simultaneously with the hydrophobization liquid supplying step; and a drying step of drying the substrate to which the hydrophobization liquid has been supplied.
申请公布号 US9259758(B2) 申请公布日期 2016.02.16
申请号 US201314011285 申请日期 2013.08.27
申请人 SCREEN HOLDINGS CO., LTD. 发明人 Emoto Tetsuya;Okutani Manabu
分类号 B05D3/12;B05D1/00;B05C9/12;B05D5/08;H01L21/67;B05D3/02;B05D3/04 主分类号 B05D3/12
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. A substrate treatment method for treating a front surface of a substrate formed with a predetermined pattern, the method comprising: a liquid film forming step of forming a liquid film of a treatment liquid on the front surface of the substrate; a hydrophobization liquid supplying step of supplying a hydrophobization liquid to a center portion of the front surface of the substrate for hydrophobizing the front surface of the substrate, while rotating the substrate; an inactivation suppressing step of suppressing inactivation of the supplied hydrophobization liquid on a peripheral edge portion of the front surface of the substrate simultaneously with the hydrophobization liquid supplying step; and a drying step of drying the substrate to which the hydrophobization liquid has been supplied, wherein the inactivation suppressing step includes a heating step of heating at least one of the substrate and the hydrophobization liquid supplied to the front surface of the substrate, wherein at least one of a center portion of the substrate and the hydrophobization liquid supplied to the center portion of the front surface of the substrate is heated with a smaller heat amount per unit area than a peripheral edge portion of the substrate and a hydrophobization liquid supplied to the peripheral edge portion of the front surface of the substrate in the heating step.
地址 Kyoto JP