| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat curable conductive paste composition at low cost, capable of achieving high conductivity and reducing thickening of the line width of a conductive pattern formed on a base material. <P>SOLUTION: A heat curable conductive paste composition according to the present invention contains, silver powder (A), a heat curing component (B), a hardener (C), a solvent (D), and, if needed, an additive (E), and further has a storage elastic modulus measured by a rheometer of 100-400 Pa. Accordingly, a high definition conductive pattern can be formed at low cost while high conductivity is achieved. <P>COPYRIGHT: (C)2013,JPO&INPIT |
