Stacked MEMS microphone packaging method

摘要

A stacked MEMS microphone packaging method includes the steps of: providing a substrate having a conducting part and a through hole; affixing a retaining wall to the substrate and forming a conducting circuit in electrical connection with the conducting part; mounting a processor chip and a sensor chip on the substrate to have the sensor chip be disposed at a top side of the through hole; providing a carrier board having a first solder pad and a second solder pad and fixedly mounting the carrier board at the retaining wall and electrically coupled to the first solder pad and the second solder pad. Thus, the method can make a flip architecture MEMS microphone, reducing the steps of the packaging process and lowering the degree of difficulty of the manufacturing process and the manufacturing costs.

主权项

1. A stacked MEMS microphone packaging method, comprising the steps of:
A) providing a substrate comprising a conducting part and a through hole; B) providing a retaining wall comprising a conducting circuit and fixedly mounting the retaining wall at the substrate to have the conducting circuit be electrically coupled to the conducting part; C) mounting a processor chip on the substrate and electrically connecting the processor chip to the conducting part; D) mounting a sensor chip on the substrate over the through hole and adjacent to the processor chip and electrically connecting the sensor chip to the processor chip; E) providing a carrier board having a first solder pad and a second solder pad and fixedly mounting the carrier board at the retaining wall to cover the processor chip and the sensor chip and to have the conducting circuit be disposed between the conducting part and one of the first solder pad and second solder pad and electrically coupled to the conducting part, the first solder pad and the second solder pad; and F) forming a connection part on said carrier board and electrically coupling said connection part to said conducting circuit, said first solder pad and said second solder pad, wherein said conducting cart comprises a first contact, a second contact, a third contact and a fourth contact; said conducting circuit comprises a first lead wire, a second lead wire and a third lead wire; said connection part comprises a first leading point, a second leading point and a third leading point; said processor chip is electrically connected to said first contact; said first lead wire has two opposite ends thereof respectively electrically coupled to said second contact and said first leading point; said second lead wire has two opposite ends thereof respectively electrically coupled to said third contact and said second leading point; said third lead wire has two opposite ends thereof respectively electrically coupled to said fourth contact and said third leading point; said first leading point is electrically connected to said first solder pad; said second leading point and said third leading point are respectively electrically connected to said second solder pad.