Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

摘要

An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may incorporate a photo-emitter chip and a photo-detector chip that may be inclined for a desired angle of incidence relative to the cover glass. A CMOS integrated optical transceiver package may include inclined photonic chips and a non-inclined CMOS chip having at least one of a photo-emitter driver, or a photo-detector TIA and/or ADC. A chip package lead frame may include cantilevered paddle tabs amenable to controlled deflection during package assembly. An inclined packaging assembly method may include attaching a chip to a lead frame paddle and form pressing the lead frame to incline the chip to a desired angle before encapsulation.

主权项

1. A chip package lead frame, the lead frame comprising:
one or more tie bar; a paddle tab to support a chip, the paddle tab cantilevered from a remainder of the lead frame by the one or more tie bar; and one or more contact pad to couple an electrical signal to and from the lead frame, wherein the one or more tie bar has a smaller cross-sectional area than the paddle tab.