发明名称 LIGHT EMITTING DEVICE PACKAGE
摘要 Provided is a light emitting diode package. To this end, the light emitting diode package comprises: a package body; a first lead frame and a second lead frame provided in the package body; light emitting diodes electrically coupled to the first lead frame and the second lead frame, respectively; and piezoelectric elements provided in the package body and electrically coupled to the first lead frame and the second lead frame, respectively. According to an embodiment of the present invention, the light emitting diode package is designed to continuously supply voltage to the light emitting diode.
申请公布号 KR20160017446(A) 申请公布日期 2016.02.16
申请号 KR20140100976 申请日期 2014.08.06
申请人 LG INNOTEK CO., LTD. 发明人 KWACK, HO SANG
分类号 H01L33/62;H01L41/08 主分类号 H01L33/62
代理机构 代理人
主权项
地址