发明名称 発光装置と、回路基板の製造方法
摘要 A light emitting device comprises a light emitting element and a package constituted by a molded article and a first lead and a second lead embedded in the molded article, and having a bottom face, a top face disposed opposite to the bottom face, and a light emission face connected to the bottom face and the top face. The first lead has a first terminal part exposed at the bottom face exposed at the top face. The exposed part is provided more toward the center of the package than the first terminal part.
申请公布号 JP5862572(B2) 申请公布日期 2016.02.16
申请号 JP20120542887 申请日期 2011.11.02
申请人 日亜化学工業株式会社 发明人 山下 良平;三木 倫英;玉置 寛人
分类号 H01L33/62 主分类号 H01L33/62
代理机构 代理人
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