| 发明名称 | POP structures with dams encircling air gaps and methods for forming the same | ||
| 摘要 | A device includes a bottom package component that includes a bottom die, and a dam over a top surface of the bottom die. The dam has a plurality of sides forming a partial ring, with an air gap surrounded by the plurality of side portions. The air gap overlaps the bottom die. A top package component is bonded to the bottom package component, wherein the air gap separates a bottom surface of the top package component from the bottom die. | ||
| 申请公布号 | US9263377(B2) | 申请公布日期 | 2016.02.16 |
| 申请号 | US201213675628 | 申请日期 | 2012.11.13 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Yu Chen-Hua;Wang Tsung-Ding;Chen Chen-Shien;Liu Chung-Shi;Wu Jiun Yi |
| 分类号 | H01L23/48;H01L21/50;H01L23/498;H01L23/29;H01L21/56;H01L25/10;H01L25/00;H01L23/31;H01L23/00;H01L23/36 | 主分类号 | H01L23/48 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A device comprising: a bottom package component comprising a bottom die; a dam over a top surface of the bottom die, wherein the dam comprises a plurality of side portions forming a partial ring, with an opening in one of the plurality of side portions of the dam and an air gap surrounded by the plurality of side portions, and wherein the air gap overlaps the bottom die; a top package component bonded to the bottom package component, wherein the air gap separates a bottom surface of the top package component from the bottom die; and a molding material dispensed between the top package component and the bottom package component, with the molding material contacting outer sidewalls of the dam. | ||
| 地址 | Hsin-Chu TW | ||