| 发明名称 | Anisotropic conductive film and semiconductor device | ||
| 摘要 | A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate. | ||
| 申请公布号 | US9263372(B2) | 申请公布日期 | 2016.02.16 |
| 申请号 | US201213721407 | 申请日期 | 2012.12.20 |
| 申请人 | CHEIL INDUSTRIES, INC. | 发明人 | Han Jae Sun;Kim Hyun Wook;Namkung Hyun Hee;Seo Jin Young;Jung Kwang Jin;Uh Dong Seon |
| 分类号 | B32B27/00;H01L23/482;H01L23/00;C09J7/00;C09J9/02 | 主分类号 | B32B27/00 |
| 代理机构 | Lee & Morse, P.C. | 代理人 | Lee & Morse, P.C. |
| 主权项 | 1. A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including: a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate, wherein the anisotropic conductive film has: an adhesive strength of about 700 gf/cm or more, as measured after pressing at 160° C. and 3 MPa for 5 seconds, anda storage modulus of about 1,000 MPa or more at a degree of cure of 90% or more. | ||
| 地址 | Gumi-si, Gyeongsangbuk-do KR | ||