Semiconductor device having parallel conductive lines including a cut portion and method of manufacturing the same

摘要

A semiconductor device includes a plurality of parallel conductive lines that are spaced apart from one another in a first direction and extend in a second direction transverse to the first direction. The parallel conductive lines includes first and second lines that are adjacent, and a third line that is adjacent to the second line, and the first and third lines each have a cut portion at different points along the second direction.

主权项

1. A semiconductor device comprising:
a wiring pattern that includes a plurality of parallel conductive lines that are spaced apart from one another in a first direction and extend in a second direction transverse to the first direction, wherein the parallel conductive lines includes first and second lines that are adjacent, a third line that is adjacent to the second line, the first and third lines each having a cut portion at different points along the second direction, fourth and fifth lines adjacent to the third line, each having a cut portion that is substantially aligned in the second direction with the cut portion of the third line, and sixth and seventh lines adjacent to the first line, each having a cut portion that is substantially aligned in the second direction with the cut portion of the first line.