发明名称 COPOLYMERIZED POLYAMIDE RESIN, METHOD FOR PREPARING THE SAME AND ARTICLE COMPRISING THE SAME
摘要 A copolymerized polyamide resin of the present invention is a polymer comprising a dicarboxylate component, and a mixture of monomer including a diamine component including 4-19 mole% of alicyclic diamine as displayed in chemical formula 1. A melting point (Tm) of the polymer ranges from 280 to 330°C, and a crystallization point (Tc) ranges from 250 to 300°C. The copolymerized polyamide resin has crystallizability, heat resistance, machinability, anti-discoloration, and excellent physical balance between the above properties. In chemical formula 1, R1 and R2 respectively and independently are an alkyl group with 1 to 5 carbons, or an aryl group of 6 to 10 carbons. m and n respectively and independently are an integer ranging from 0 to 4.
申请公布号 KR20160017197(A) 申请公布日期 2016.02.16
申请号 KR20140098556 申请日期 2014.07.31
申请人 SAMSUNG SDI CO., LTD. 发明人 KWON, SO YOUNG;KIM, JOON SUNG;LEE, EUN JU;LEE, KI YON;CHOI, SUNG CHUL
分类号 C08G69/26;C08G69/28;C08J5/00;C08L77/06 主分类号 C08G69/26
代理机构 代理人
主权项
地址