| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transfer device and a transfer method capable of accurately dividing an adhesive layer along the shape of a flake body. <P>SOLUTION: A transfer device 1 comprises: first support means 2 for supporting a wafer W via an adhesive sheet S1 and a ring frame RF1; second support means 3 for supporting a transfer sheet S2 by arranging the sheet so as to face the wafer W; contact means 4 for making the wafer W come close to or separate from the transfer sheet S2 with each other; fluidization means 5 for fluidizing an adhesive layer AD2 of the transfer sheet S2; and cutting means 6 for cutting the adhesive layer AD2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
