| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of removing a chamfering portion of a wafer capable of efficiently removing a chamfering portion formed in an outer periphery of the wafer without contaminating a device surface and the outer periphery of the wafer. <P>SOLUTION: A method of removing an outer periphery chamfering portion of a wafer in which a device is formed in a plurality of regions partitioned by a plurality of streets formed on a surface in a lattice shape includes: a protective member sticking step of sticking a protective member T to a surface of a wafer 2; a chamfering portion cutting step of rotating and positioning a cutting blade 323 mounted on a rotary spindle at a chamfering portion boundary of an outer peripheral excess region while rotating a chuck table 31 holding the protective member side on the surface of the wafer and cutting the chamfering portion; and a chamfering portion grinding step of rotating and positioning a grinding wheel 333 mounted on the rotary spindle at the chamfering portion cut without being in contact with a cutting surface of the outer peripheral excess region while rotating the chuck table and removing the cut chamfering portion by grinding it. <P>COPYRIGHT: (C)2012,JPO&INPIT |
