发明名称 |
Solid-state image pickup device |
摘要 |
A solid-state imaging apparatus having a plurality of pixels, comprising: a substrate; a wiring layer formed on the substrate and including an insulating film and a plurality of wires; a plurality of lower electrodes formed on the wiring layer in one-to-one correspondence with the plurality of pixels; a photoelectric conversion film formed covering the plurality of lower electrodes; a light-transmissive upper electrode formed on the photoelectric conversion film; and a shield electrode extending through a gap between each pair of adjacent lower electrodes among the plurality of lower electrodes, the shield electrode having a fixed potential and being electrically insulated from the plurality of lower electrodes. |
申请公布号 |
US9263482(B2) |
申请公布日期 |
2016.02.16 |
申请号 |
US201314142646 |
申请日期 |
2013.12.27 |
申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
Doi Hiroyuki;Yasuhira Mitsuo;Miyagawa Ryohei;Ohmori Yoshiyuki |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
McDermott Will & Emery LLP |
代理人 |
McDermott Will & Emery LLP |
主权项 |
1. A solid-state imaging apparatus having a plurality of pixels, comprising:
a substrate; a wiring layer formed on the substrate and including an insulating film and a plurality of wires; a plurality of lower electrodes formed on the wiring layer in one-to-one correspondence with the plurality of pixels; a photoelectric conversion film formed covering the plurality of lower electrodes; a light-transmissive upper electrode formed on the photoelectric conversion film; a shield electrode between a pair of adjacent lower electrodes among the plurality of lower electrodes, the shield electrode having a fixed potential and being electrically insulated from the plurality of lower electrodes, and a shield wire, between a pair of adjacent wires among the plurality of wires, having a fixed potential, being electrically insulated from the plurality of wires, and being electrically connected to the shield electrode. |
地址 |
Osaka JP |