| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder bonded body in which a solder material is bonded to the surface of a non-oxide ceramic adherend without requiring any special bonding device. <P>SOLUTION: The solder bonded body is obtained by heat treating a solder material brought into contact with the top of a non-oxide ceramic adherend at a temperature in the range from the solidus temperature to the liquidus temperature of the solder material, thereby bonding a solder layer to the adherend. <P>COPYRIGHT: (C)2013,JPO&INPIT |
