发明名称 研磨用シリカゾル、研磨用組成物及び研磨用シリカゾルの製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide silica sol for polishing, having a high polishing rate and suitable for precision polishing, and to provide a polishing composition and a method for producing silica sol for polishing. <P>SOLUTION: The silica sol is obtained by dispersing, in a dispersion medium, nonspherical silica fine particles having an average particle diameter measured by dynamic light scattering method in the range of 5-300 nm, and has solid concentration of 10-60 wt.%, wherein, in the peak areas at chemical shifts of -73 to -120 ppm in<SP POS="POST">29</SP>Si-NMR spectrum measurement, the area of Q4 is &ge;88% and the area of Q3 is &le;11%, provided that the chemical shifts are based on tetramethylsilane as a reference material, Q4 is a peak in the range of -100 to -120 ppm, and Q3 is a peak in the range of -82 to -100 ppm. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5860587(B2) 申请公布日期 2016.02.16
申请号 JP20100262683 申请日期 2010.11.25
申请人 日揮触媒化成株式会社 发明人 俵迫 祐二;西田 広泰;向井 達也
分类号 C09K3/14;B24B37/00;C01B33/143;G11B5/84;H01L21/304 主分类号 C09K3/14
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