发明名称 Apparatus and method for treating substrate
摘要 Provided are an apparatus and method for treating a substrate, and more particularly, to a substrate treatment apparatus having a cluster structure and a substrate treatment method using the same. The apparatus for treating the substrate includes a load port on which a container for receiving the substrate is placed, a treatment module for treating the substrate, and a transfer module including a robot for transferring the substrate between the container and the treatment module. The treatment module includes a transfer chamber including a robot for transferring the substrate, a load lock chamber disposed between the transfer chamber and the transfer module, a first treatment chamber disposed spaced from the transfer module around the transfer chamber to perform a first treatment process, and a second treatment chamber disposed around the transfer chamber to perform a second treatment process.
申请公布号 US9263307(B2) 申请公布日期 2016.02.16
申请号 US201213485300 申请日期 2012.05.31
申请人 Semes Co., Ltd. 发明人 Kim Hyung Joon
分类号 B25J11/00;H01L21/677;F27D3/00;H01L21/67;C23F1/00;B05D3/02;C23C16/513;B05D1/00 主分类号 B25J11/00
代理机构 Jenkins, Wilson, Taylor & Hunt, P.A. 代理人 Jenkins, Wilson, Taylor & Hunt, P.A.
主权项 1. An apparatus for treating a substrate, the apparatus comprising: a load port on which a container for receiving the substrate is placed; a treatment module for treating the substrate; and a transfer module comprising a robot for transferring the substrate between the container and the treatment module; wherein the treatment module comprises: a transfer chamber comprising a robot for transferring the substrate,a load lock chamber disposed between the transfer chamber and the transfer module,a first treatment chamber spaced apart from the transfer module about a perimeter of the transfer chamber to perform a first treatment process, anda second treatment chamber disposed around the transfer chamber to perform a second treatment process, wherein the second treatment chamber comprises a housing disposed under the load lock chamber, a plasma source disposed above the load lock chamber to generate plasma, and a supply tube disposed on an outer wall of the load lock chamber to supply the generated plasma into the housing; andwherein the second treatment chamber is disposed between the transfer chamber and the transfer module and is configured to transfer the substrate between the transfer module and the treatment module.
地址 Cheonan-si, Chungcheongnam-do KR
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