发明名称 |
Apparatus and method for treating substrate |
摘要 |
Provided are an apparatus and method for treating a substrate, and more particularly, to a substrate treatment apparatus having a cluster structure and a substrate treatment method using the same. The apparatus for treating the substrate includes a load port on which a container for receiving the substrate is placed, a treatment module for treating the substrate, and a transfer module including a robot for transferring the substrate between the container and the treatment module. The treatment module includes a transfer chamber including a robot for transferring the substrate, a load lock chamber disposed between the transfer chamber and the transfer module, a first treatment chamber disposed spaced from the transfer module around the transfer chamber to perform a first treatment process, and a second treatment chamber disposed around the transfer chamber to perform a second treatment process. |
申请公布号 |
US9263307(B2) |
申请公布日期 |
2016.02.16 |
申请号 |
US201213485300 |
申请日期 |
2012.05.31 |
申请人 |
Semes Co., Ltd. |
发明人 |
Kim Hyung Joon |
分类号 |
B25J11/00;H01L21/677;F27D3/00;H01L21/67;C23F1/00;B05D3/02;C23C16/513;B05D1/00 |
主分类号 |
B25J11/00 |
代理机构 |
Jenkins, Wilson, Taylor & Hunt, P.A. |
代理人 |
Jenkins, Wilson, Taylor & Hunt, P.A. |
主权项 |
1. An apparatus for treating a substrate, the apparatus comprising:
a load port on which a container for receiving the substrate is placed; a treatment module for treating the substrate; and a transfer module comprising a robot for transferring the substrate between the container and the treatment module; wherein the treatment module comprises:
a transfer chamber comprising a robot for transferring the substrate,a load lock chamber disposed between the transfer chamber and the transfer module,a first treatment chamber spaced apart from the transfer module about a perimeter of the transfer chamber to perform a first treatment process, anda second treatment chamber disposed around the transfer chamber to perform a second treatment process, wherein the second treatment chamber comprises a housing disposed under the load lock chamber, a plasma source disposed above the load lock chamber to generate plasma, and a supply tube disposed on an outer wall of the load lock chamber to supply the generated plasma into the housing; andwherein the second treatment chamber is disposed between the transfer chamber and the transfer module and is configured to transfer the substrate between the transfer module and the treatment module. |
地址 |
Cheonan-si, Chungcheongnam-do KR |