| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for laminate, which is excellent especially in drilling workability, low thermal expansion, heat resistance, and electric insulation, and is suitably used for semiconductor packages and the like; and to provide a prepreg, and the laminate. <P>SOLUTION: The resin composition for laminate comprises a thermosetting resin, a silica, and aqueous zinc molybdate (Zn<SB POS="POST">3</SB>Mo<SB POS="POST">2</SB>O<SB POS="POST">8</SB>(OH)<SB POS="POST">2</SB>) in which the atomic ratio of zinc to molybdenum is 3:2. The silica accounts for 40 to 60 vol.% of the whole resin composition, whereas the aqueous zinc molybdate (Zn<SB POS="POST">3</SB>Mo<SB POS="POST">2</SB>O<SB POS="POST">8</SB>(OH)<SB POS="POST">2</SB>) accounts for 0.5 to 10 vol.% of the whole resin composition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
