SEMICONDUCTOR PACKAGE AND METHODS FOR MANUFACTURING THE SAME

摘要

A semiconductor package is provided. The semiconductor package comprises: a lower package which includes a lower semiconductor chip mounted on a lower package substrate; an upper package which includes an upper package substrate laminated on the lower package, and an upper semiconductor chip mounted on the upper package substrate; connection terminals which electrically connect the lower package substrate to the upper package substrate; and a lower molding film which molds the lower semiconductor chip between the lower package substrate and the upper package substrate. The lower package substrate includes a chip area in which the lower semiconductor chip is mounted, a connection area which partially surrounds the chip area, and a mold injection area which is defined by the chip area and the connection area. The connection terminals are disposed on the lower package substrate in the connection area, but not disposed on the lower package substrate in the mold injection area.