发明名称 Set top box having heat sink pressure applying means
摘要 Described is an electronic device, including a top frame, a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, a heat sink associated with the thermal pad and a plurality of springs for providing a biasing force that retains the heat sink against the thermal pad, the heat sink including a planar portion surrounding a central depression, wherein the plurality of springs secure the thermal pad of the circuit board between the central depression portion of the heat sink and the circuit board.
申请公布号 US9265180(B2) 申请公布日期 2016.02.16
申请号 US201314424288 申请日期 2013.07.23
申请人 THOMSON LICENSING 发明人 Dernier William Phillip;Williams Kevin Michael
分类号 H05K7/20;H05K1/02 主分类号 H05K7/20
代理机构 代理人 Shedd Robert D.;Cooper Catherine A.
主权项 1. An electronic device, comprising: a top frame; a bottom frame; a circuit board mounted above said bottom frame; a thermal pad mounted on said circuit board; a heat sink associated with said thermal pad; and a plurality of springs for providing a biasing force that retains said heat sink against said thermal pad, said heat sink including a planar portion surrounding a central depression, wherein the plurality of springs secure said thermal pad of said circuit board between said central depression portion of said heat sink and said circuit board, wherein said springs are each made of an elongated strip of metal bent such that a V-shape is formed, wherein said plurality of springs have an aperture therein to engage vertical posts protruding from said top frame of said device, wherein said top frame of said device also includes a plurality of bent mesa or inwardly facing U-shaped structures having three sides to surround one end and two sides of each of said springs when said springs are placed on said vertical posts.
地址 Issy les Moulineaux FR