| 发明名称 |
Carrier with hollow chamber and support structure therein |
| 摘要 |
According to various embodiments, a carrier may include: a hollow chamber spaced apart from a surface of the carrier; and at least one support structure within the hollow chamber connecting a first region of the carrier disposed over the hollow chamber with a second region of the carrier disposed below the hollow chamber, wherein at least a part of a surface of the at least one support structure is spaced apart from an inner surface of the hollow chamber, and wherein the at least one support structure includes an electrically insulating material. |
| 申请公布号 |
US9263357(B2) |
申请公布日期 |
2016.02.16 |
| 申请号 |
US201314098580 |
申请日期 |
2013.12.06 |
| 申请人 |
INFINEON TECHNOLOGIES DRESDEN GMBH |
发明人 |
Bieselt Steffen |
| 分类号 |
H01L23/053;H01L21/02;H01L21/48;H01L21/762;H05K1/02 |
主分类号 |
H01L23/053 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A carrier comprising:
a hollow chamber spaced apart from a surface of the carrier; and at least one support structure within the hollow chamber connecting a first region of the carrier disposed over the hollow chamber with a second region of the carrier disposed below the hollow chamber, wherein at least a part of a surface of the at least one support structure is spaced apart from an inner surface of the hollow chamber, and wherein the at least one support structure comprises an electrically insulating material, wherein the at least one support structure comprises a core region and a liner structure at least laterally surrounding the core region, the core region comprising the electrically insulating material. |
| 地址 |
Dresden DE |
