| 发明名称 | Lead-free solder alloys and solder joints thereof with improved drop impact resistance | ||
| 摘要 | Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably contain 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn. | ||
| 申请公布号 | US9260768(B2) | 申请公布日期 | 2016.02.16 |
| 申请号 | US200611567525 | 申请日期 | 2006.12.06 |
| 申请人 | Indium Corporation | 发明人 | Liu Weiping;Lee Ning-Cheng |
| 分类号 | C22C13/00;C22C13/02 | 主分类号 | C22C13/00 |
| 代理机构 | Sheppard Mullin Richter & Hampton LLP | 代理人 | Sheppard Mullin Richter & Hampton LLP |
| 主权项 | 1. A lead-free solder alloy consisting essentially of an amount of Ag greater than 0 wt. % and less than or equal to about 2.6 wt. %, 0.01-1.5 wt. % of Cu, and at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, and Ti in an amount of 0.001-0.8 wt. %, and the remainder of Sn. | ||
| 地址 | Clinton NY US | ||