EXPOSED, SOLDERABLE HEAT SPREADER FOR INTEGRATED CIRCUIT PACKAGES

摘要

An integrated circuit package comprises a semiconductor die, a heat spreader, and an encapsulation material. The semiconductor die comprises an electronic circuit and an electrical connection part exposed to the electronic circuit. The heat spreader is thermally-conductive and has a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface is attached to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material is non-electrically conductive and completely encapsulates the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second outer surface of the heat spreader is solderable and forms a portion of an exterior surface of an integrated circuit flip-chip package.