RESIN SHEET, LAMINATED SHEET, LAMINATED PLATE AND SEMICONDUCTOR DEVICE

摘要

Provided is a resin sheet. The resin sheet is for circuit formation which is stacked on an insulating resin layer. According to the present invention, an insulating layer which has low surface roughness after a roughening method and good reflow tolerance, is provided. Also, a thin resin composite layer which prevents the generation of a pin hole is formed. The resin sheet is a resin sheet for circuit formation which is stacked on an insulating resin layer. The resin sheet includes a supporter and a resin composite layer bonded to the supporter. The thickness of the rein composite layer is 0.1 to 6μm. The resin composite layer contains (A) epoxy resin and (B) active ester hardener.