发明名称 |
PRINTED CIRCUIT BOARD |
摘要 |
The purpose of the present invention is to minimize a bending phenomenon, and form a uniform thickness. The present invention relates to a printed circuit board which comprises: an insulating substrate; a first circuit pattern formed on one surface of the insulating substrate; a second circuit pattern formed on the other surface of the insulating substrate; and an element arranged on one surface of the insulating substrate inside the insulating substrate. |
申请公布号 |
KR20160016033(A) |
申请公布日期 |
2016.02.15 |
申请号 |
KR20140099186 |
申请日期 |
2014.08.01 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
LEE, WOO YOUNG;JUNG, WON SUK;YOON, JAE HYUN;LEE, KYU WON |
分类号 |
H05K3/46;H05K1/02;H05K1/18 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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