发明名称 PRINTED CIRCUIT BOARD
摘要 The purpose of the present invention is to minimize a bending phenomenon, and form a uniform thickness. The present invention relates to a printed circuit board which comprises: an insulating substrate; a first circuit pattern formed on one surface of the insulating substrate; a second circuit pattern formed on the other surface of the insulating substrate; and an element arranged on one surface of the insulating substrate inside the insulating substrate.
申请公布号 KR20160016033(A) 申请公布日期 2016.02.15
申请号 KR20140099186 申请日期 2014.08.01
申请人 LG INNOTEK CO., LTD. 发明人 LEE, WOO YOUNG;JUNG, WON SUK;YOON, JAE HYUN;LEE, KYU WON
分类号 H05K3/46;H05K1/02;H05K1/18 主分类号 H05K3/46
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