| 摘要 |
The present invention relates to a diamond coated scribing wheel for cutting an LCD panel and, more specifically, to a diamond coated scribing wheel for cutting an LCD panel suitable for cutting an LCD panel and an optical fiber, or scribing a brittle material such as glass, ceramic, a semiconductor, or the like. According to the present invention, a diamond coated scribing wheel includes a diamond layer by HFCVD wherein the surface of cemented carbide is coated. With respect to a cutting blade part of the scribing wheel, an average deposited film thickness of a diamond layer is 1.0 μm or more and 5.0 μm or less. With respect to the surface of the diamond layer, a diamond average particle size is 2.0 μm or more and 4.5 μm or less. While the surface of the diamond layer is not smoothing processed after coated, with respect to a cutting blade part of the scribing wheel, surface roughness Ra of a diamond layer surface is 0.3 μm or more and 3.0 μm or less. |
