APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

摘要

The present invention provides a substrate processing apparatus. The substrate processing apparatus includes a cup which provides a process space for processing a substrate; a substrate support unit which supports the substrate in the process space; a chemical member which injects chemical to the substrate provided in the substrate support unit; a cleaning liquid nozzle which injects cleaning liquid to the substrate provided in the substrate support unit; and a controller which controls the chemical member and the cleaning liquid nozzle. The chemical member includes a nozzle support unit which has a nozzle for injecting the chemical; a support shaft which supports the nozzle support unit; and an actuator which drives the support shaft. The controller controls the chemical member and the cleaning solution nozzle to allow the cleaning nozzle to spray the cleaning liquid onto the substrate while the chemical member is moved from a standby position which is the outside of the cup to a process position which is a position of injecting the chemical.