ELECTROSTATIC CHUCK ASSEMBLIES, SEMICONDUCOTOR FABRICATING APPARATUS HAVING THE SAME, AND PLASMA TREATMENT METHODS USING THE SAME

摘要

The present invention relates to an electrostatic chuck assembly, a semiconductor fabricating apparatus having the same, and a plasma treatment method using the same. The electrostatic chuck assembly comprises a heater dielectric layer provided on a base and having a heater electrode and an electrostatic chuck provided on the heater dielectric layer and having an electrostatic dielectric layer having an adsorption electrode. The electrostatic dielectric layer comprises an upper portion having an upper surface on which a substrate is mounted and a lower portion in which the adsorption electrode, which protrudes beyond a side surface of the upper portion and in parallel with the upper surface, is embedded.