PHOTO CURABLE ADHESIVE AND BONDING FILM COMPOSITION, ADHESIVE AND BONDING FILM AND METHOD FOR PREPARING ADHESIVE AND BONDING FILM

摘要

The purpose of the present invention is to provide a photocurable adhesive bonding composition which can manufacture an adhesive film having high peeling force to a polyimide material. Provided is a photocurable adhesive bonding composition comprising: an acrylic photocurable resin formed by polymerizing monomer elements including two kinds of different (meth)acrylic ester monomers and a photo-reactive monomer; and a photoinitiator. One kind of the two kinds of (meth)acrylic ester monomers is monomer having adhesion. The monomer having adhesion is acrylate containing a C6-C20 alicyclic condensed ring or a fused ring. The photo-reactive monomer has a photo-reaction initiated optical wavelength of 300 to 400 nm. A photo-reaction initiated optical wavelength of the photoinitiator is greater than or equal to 200 nm and less than 300 nm.