ALIGNMENT ASSEMBLY OF SEMICONDUCTOR PACKAGE, AND INSERT ASSEMBLY OF TEST TRAY HAVING THE SAME

摘要

The present invention relates to an alignment assembly of a semiconductor package and an insert assembly of a test tray including the same. The alignment assembly comprises an accommodation unit installed to provide a space for accommodating a semiconductor package; and a pressurization unit installed to pressurize both sides of one side of the accommodation unit which are adjacent to each other. And both sides of the one side of the accommodation unit are pressurized by using the pressurization unit to face both sides of the one side, and the semiconductor package is shifted to both sides of another side of the accommodation unit which are adjacent to each other to align the semiconductor package.