发明名称 SIZE OPTIMIZATION STRUCTURE FOR ASSEMBLY OF CURRENT SENSOR AND POWER CONDUCTOR
摘要 The present invention relates to a current sensor-power conductor assembly and, more specifically, to a size optimization structure for the current sensor-power conductor assembly capable of decreasing crosstalk to adjacent electric devices due to magnetic field interference, reducing the size and weight by placing a third conductor and a fourth conductor included in a power conductor vertically at regular intervals, and making a current sensor to detect the magnetic field formed by the third conductor and the fourth conductor and measure the current. An implementation of the size optimization structure for a current sensor-power conductor assembly provided in the present invention includes: a first conductor; a second conductor; a third conductor which connects the first conductor and the second conductor; a fourth conductor which is vertical to the third conductor at a certain interval and connects the first conductor and the second conductor; a current sensor which is installed between the third conductor and the fourth conductor, and measures the current by detecting the magnetic field formed by the third conductor and the magnetic field formed by the fourth conductor; a first circuit module which is installed between the current sensor and the third conductor, and connected to the current sensor; and a second circuit module which is installed between the current sensor and the fourth conductor, and connected to the current sensor.
申请公布号 KR20160016191(A) 申请公布日期 2016.02.15
申请号 KR20140099807 申请日期 2014.08.04
申请人 HYUNDAI MOBIS CO., LTD. 发明人 HWANG, BO CHEON
分类号 G01R15/00;G01R19/00 主分类号 G01R15/00
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