SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

According to the present invention, a semiconductor package comprises: a lower substrate; a first electronic device attached to one region on the lower substrate; a second electronic device attached to the other region on the lower substrate; and an upper substrate attached to the lower substrate in a way that the first electronic device is accommodated through a first cavity having an opened upper end, and the second electronic device is accommodated through a second cavity having an opened upper end. Therefore, the semiconductor package simplifies manufacturing processes and lowers costs.