| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for packaging an environmentally protected microwave integrated circuit.SOLUTION: The method includes: providing a dielectric layer over a semiconductor device 12; and determining patterns and placement 80' of metallic, dielectric or magnetic material on the dielectric layers 30, 40 photolithographically to provide a predetermined magnetic or electric effect for the device. The predetermined effect is provided on the device from such patterned and placed material solely by electrical or magnetic waves coupled between the material and the device.SELECTED DRAWING: Figure 12 |
