PROCESS AND APPARATUS FOR ARRANGING ADHESION ELEMENT ON MATRIX

摘要

PROBLEM TO BE SOLVED: To disclose a process and an apparatus for attaching a molding adhesion element to heated joint parts.SOLUTION: An apparatus comprises a hopper arranged above a matrix plate movably. The matrix plate comprises a nesting matrix defined by molding adhesion element reception holes. An ejector system is provided below the matrix plate and comprises a main body having a vacuum chamber with an intake vent and an exhaust vent. The vacuum chamber is fluidly continuous with a hole formed to the matrix plate. The ejector system comprises a hoisting body with an ejector stamp and an intake vent interception shaft. A channel for the ejector stamp is formed to the main body of the ejector system. The ejector stamp is fit to the hole and the channel movably. In operation, the hopper slides over the matrix and arranges a molding adhesion element in the hole and then slides away.SELECTED DRAWING: Figure 1