SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package comprises: a substrate having a plurality of circuit layers; at least one electronic component mounted on both surfaces of the substrate; a mold part formed on both surfaces of the substrate to enclose the electronic component; a via formed in the mold part to be electrically connected to the circuit layers of the substrate; and a semi-conductive pattern connected to one end of a plated tail connected to the circuit layers connected to the via, and exposed to the outside of the substrate. Therefore, the semiconductor package minimizes an influence of the plated tail.