| 摘要 |
The present invention relates to a heat sink block-attached LED package board comprising: a board including a board body, electrodes supplying power provided to both end portions of an upper surface of the board body, a plurality of recesses formed on the upper surface of the board body and interposed between the electrodes, a circuit pattern electrically connected to the electrodes and formed on the upper surface of the board body and the recesses, and a plurality of coupling holes formed on both side surfaces of the board body; at least one lead frame provided in a width direction of the recess; at least one LED attached to an upper surface of the at least one lead frame and wire-bonded to the at least one lead frame; an encapsulant filled in the recesses to protect the lead frame and the LED; a pair of heat sinks having a heat sink body having a plate shape and a plurality of coupling protrusions protruding from one surface of the heat sink body; and at least one heat sink block attached to the upper surface of the circuit pattern formed on the upper surface of the board body, whereby optimal reflectivity can be provided, and maximum heat dissipation of the LED package board can be realized through the pair of divided heat sinks and the heat sink blocks. |
