发明名称 |
UNIT FOR HEATING A PRINTED CIRCUIT BOARD AND APPARATUS FOR BONDING DIES INCLUDING THE SAME |
摘要 |
A substrate heating unit includes at least one vacuum plate, and at least two heating plates. The vacuum plate supports a substrate placed on an upper part and fixes the substrate. The heating plates are combined with a lower part of the vacuum plate to form at least two divided structures. The substrate is heated at different temperatures according to the divided structure. |
申请公布号 |
KR101593833(B1) |
申请公布日期 |
2016.02.12 |
申请号 |
KR20140140566 |
申请日期 |
2014.10.17 |
申请人 |
SEMES CO., LTD. |
发明人 |
LIM, SOK TAEK;LEE, WON BAE |
分类号 |
H01L21/324;H01L21/58;H01L21/603 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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