| 发明名称 |
JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC PART |
| 摘要 |
A joint structure that includes a first metal member, a second metal member, and a joint portion sandwiched between the first metal member and the second metal member. At least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a Cu3Sn layer nor a Cu6Sn5 layer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member. |
| 申请公布号 |
US2016043480(A1) |
申请公布日期 |
2016.02.11 |
| 申请号 |
US201514918648 |
申请日期 |
2015.10.21 |
| 申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
Nakano Kosuke;Takaoka Hidekiyo |
| 分类号 |
H01R4/02;H01R4/58 |
主分类号 |
H01R4/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A joint structure comprising:
a first metal member; a second metal member; and a joint portion sandwiched between the first metal member and the second metal member, wherein at least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a Cu3Sn layer nor a Cu6Sn5 layer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member. |
| 地址 |
Nagaokakyo-shi JP |
