| 发明名称 |
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE |
| 摘要 |
A light emitting device includes a semiconductor light emitting element including a semiconductor stacked-layer body and an electrode disposed on a first surface of the semiconductor stacked-layer body; a resin member disposed on a first surface side of the semiconductor stacked-layer body; and a metal layer disposed in the resin member and electrically connected to the electrode. A recess is defined in an upper surface of the resin member. The metal layer is projected from the upper surface of the resin member, and is disposed to surround at least a portion of the recess. |
| 申请公布号 |
US2016043290(A1) |
申请公布日期 |
2016.02.11 |
| 申请号 |
US201514821369 |
申请日期 |
2015.08.07 |
| 申请人 |
Nichia Corporation |
发明人 |
SOGO Takayuki;SOGAI Takanobu;KUSUSE Takeshi |
| 分类号 |
H01L33/54;H01L21/78;H01L33/00;H01L33/56;H01L33/58 |
主分类号 |
H01L33/54 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device comprising:
a semiconductor light emitting element including a semiconductor stacked-layer body and an electrode disposed on a first surface of the semiconductor stacked-layer body; a resin member disposed on a first surface side of the semiconductor stacked-layer body; and a metal layer disposed in the resin member and electrically connected to the electrode; wherein a recess is defined in an upper surface of the resin member, and wherein the metal layer is projected from the upper surface of the resin member, and is disposed to surround at least a portion of the recess. |
| 地址 |
Anan-shi JP |
