| 发明名称 |
MULTI-CHIP MODULE WITH REWORK CAPABILITY |
| 摘要 |
Multi-chip underfills and methods for multi-chip module fabrication include connecting one or more chips to a substrate with one or more electrical connections; partially curing an underfill material such that the underfill provides structural support to the electrical connections; electrically testing the one or more chips to identify one or more defective chips; and replacing the one or more defective chips. |
| 申请公布号 |
US2016042979(A1) |
申请公布日期 |
2016.02.11 |
| 申请号 |
US201414456025 |
申请日期 |
2014.08.11 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Gaynes Michael A.;Gelorme Jeffrey D.;Nah Jae-Woong |
| 分类号 |
H01L21/56;C08G59/24;C08G59/50;H01L21/66 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for multi-chip module fabrication, comprising:
applying an underfill material either to a substrate or to one or more chips; connecting the one or more chips to the substrate with one or more electrical connections after applying the underfill material; partially curing the underfill material such that the underfill provides structural support to the electrical connections; electrically testing the one or more chips to identify one or more defective chips; and replacing the one or more defective chips. |
| 地址 |
Armonk NY US |
