| 发明名称 |
THERMAL INTERFACE MATERIAL ON PACKAGE |
| 摘要 |
A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly. |
| 申请公布号 |
US2016042976(A1) |
申请公布日期 |
2016.02.11 |
| 申请号 |
US201514921026 |
申请日期 |
2015.10.23 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DE SOUSA Isabel;LAVOIE Annique;SALVAS Eric;TURGEON Michel |
| 分类号 |
H01L21/48;H01L21/3105;H01L21/52;H01L21/56 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
dispensing a thermal interface material (TIM) on an electronic assembly; removing volatile species of the TIM, prior to lid placement on the electronic assembly; placing the lid on the TIM, over the electronic assembly; and pressing the lid onto the electronic assembly, wherein the removal of the volatile species comprises subjecting the TIM to an outgassing process. |
| 地址 |
Armonk NY US |
