RADIO FREQUENCY MODULE INCLUDING SEGMENTED CONDUCTIVE TOP LAYER

摘要

A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF devices disposed on the module. The conductive top layer may be segmented as to form one or more segments of the top layer that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated, top conductive layers correspond to different devices of the module. The top layer may be etched or cut to achieve such segmentation.

主权项

1. A radio frequency (RF) module, comprising:
a packaging substrate configured to receive a plurality of components; and first and second RF devices implemented on the packaging substrate; a plurality of wirebond structures implemented on the packaging substrate between the first RF device and the second RF device; a first conductive ground layer in electrical contact with the plurality of wirebond structures; a first conductive top layer disposed at least partially above the first RF device; and a second conductive top layer in electrical contact with the plurality of wirebond structures, the second conductive top layer being at least partially electrically isolated from the first conductive top layer, the first conductive ground layer, the plurality of wirebond structures, and the second conductive top layer forming an RF barrier between the first RF device and the second RF device.