| 摘要 |
A wiring substrate includes an insulating substrate having a quadrangular planar outline; a quadrangular frame positioned on the surface of the insulating substrate along the periphery, and including an upper surface, a corner portion, and an adjacent portion, the corner portion including a width-expanded portion defining a via hole extending through the frame, the width-expanded portion including an inner wall surface having a rectilinear edge in a plan view, the adjacent portion including an inner wall surface, the inner wall surface of the width-expanded portion forming an obtuse angle with the inner wall surface of the adjacent portion; a via conductor filling the via hole and not exposed from the inner wall surface of the width-expanded portion; and a sealing metallization layer formed on the upper surface of the frame and electrically connected to the via conductor. |
| 主权项 |
1. A wiring substrate comprising:
an insulating substrate having a substantially quadrangular planar shape and including a surface having a periphery and a mounting region for mounting of an electronic component; a frame having a substantially quadrangular shape, positioned on the surface of the insulating substrate along the periphery of the surface, and surrounding the mounting region, the frame defining a cavity for accommodating the electronic component and including an upper surface, a corner portion, and an adjacent portion to the corner portion, the corner portion including a width-expanded portion expanding toward the mounting region and defining a via hole having a diameter of 100 μm or less and extending in a thickness direction, the width-expanded portion including an inner wall surface having a rectilinear edge in a plan view, the adjacent portion including an inner wall surface and having a width of 150 μm or less, and the inner wall surface of the width-expanded portion forming an obtuse angle with the inner wall surface of the adjacent portion; a via conductor filling the via hole and not exposed from the inner wall surface of the width-expanded portion; and a sealing metallization layer formed on the upper surface of the frame and electrically connected to the via conductor. |
