INSULATING FILM, PRINTED CIRCUIT BOARD USING THE SAME AND METHOD FOR MANUFACTURING THEREOF

摘要

The present invention relates to an insulating film which can reduce the number of processes by skipping an additional ground layer forming process, a printed circuit board including the same, and a manufacturing method thereof. According to an embodiment of the present invention, the insulating film comprises: a first insulating material; a second insulating material; and a metal thin film disposed between the first insulating material and the second insulating material.